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INSPECTION/METROLOGY/MEASUREMENT |
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DESCRIPTION |
MAKE |
MODEL
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| INSPECTION/METROLOGY/MEASUREMENT | ||
ANALYZER, WAFER /DISK, X-ray spectrometer, 200mm Wafer, Measures: Al (Thickness and Cu Wt%), 10K - PHA Films <3300A, 2030 LTS Ti Thickness, AMAT TiN Thickness, W CVD Thickness, W Nucleation, WSi Thickness, ULVAC TiN Thickness, BSG Boron wt%, BPSG Boron wt% |
RIGAKU |
WDA-3630 |
| CRITICAL DIMENSION
OVERLAY SYSTEM, 200mm Wafer, Unix Operating System, Objectives 4X,30X,70X, Xenon Lamp, SECS/GEM Interface, Ethernet Connection, Manf. 11/98 |
BIO-RAD |
Q7/ Q8 |
| DEFECT REVIEW SYSTEM Casette to Casette, 200mm, Color Camera and Monitor | LEICA/VISTEC | INS 2000 |
| DIELECTRIC CHARACTERIZATION
SYSTEM, Cocos, Silc, Epi-t, 200mm- 300mm, - Whole Wafer Mapping of Mobile Na Contamination in Oxide (~6000 Points in 12 Minutes), Tests Dielectric Capacitance / Electrical Thickness, Precise Determination of Flatband, Midgap and Oxide Voltages & Si Surface Barrier Height, Manf. 1999 |
SEMICONDUCTOR DIAGONISTICS
INC. |
FAaST 300 |
| HEAVY METAL CONTAMINATION SYSTEM, SPV, 200mm-300mm, Non-Contact, Non-Destructive Measurements of Heavy Metal Contamination in Silicon, Whole Wafer Mapping in Minutes (>6000 Points in 9 Minutes), Whole Wafer Optical Fe Activation Station, Real-Time Identification of Iron & Copper, Sensitivity for FE: 1EB cm-2, Manf, 1997 | SEMICONDUCTOR DIAGONISTICS INC. |
FAaST 330 |
| HEAVY METAL CONTAMINATION
SYSTEM, SPV, Silc, Cocos, 100mm To 200mm Wafers, Fully Automated, Identifies Fe (Iron) AND Cu (Cooper) Contamination, Sensitivity Fe1E8 cm-2, Wafer Imaging >6000 Points in 9 Minutes, Auto Self Calibration; Manf. 10/02 |
SEMICONDUCTOR DIAGONISTICS
INC. |
FAaST 200 |
| PROFILOMETER | KLA TENCOR | HRP 220 |
| PROFILOMETER | VEECO/SLOAN | DEKTAK IIA |
| SPECTROPHOTOMETER,
UV-VIS 200-900nm, Single Beam, Sipper Sampler, QUANT II, Protein Assay Module & Printer (1988) |
BECKMAN |
DU-62 |
| TOTAL REFLECTION X-RAY
FLOURESENCE, Surface Contamination Tool, 200mm Wafers |
RIGAKU |
3750 |
| X-RAY SPECTROMETER, SINGLE CASSETTE, NESLAB COOLFLOW SYSTEM II CHILLER, EBARA 40 X 20 PUMP , MANF. 4/94 |
RIGAKU |
3700H TXRF |
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| SEMICONDUCTOR FABRICATION | ||
| THERMAL PROCESSING SYSTEM, DCS HTO, 200MM, N2 Load Lock Option, FTPS Option, WAVWES control, 21 cassette buffer, 2004 Vintage, DCS Hardware/software upgrade 9/2005 | TEL | Alpha-8SE |
| THERMAL PROCESSING SYSTEM , 200MM, 100 Wafer Batch Size, Process: FEOL Oxide/Anneal, Capable of Ultra Thin Oxides (12- 16 Angstrom), Nitrous & Nitric capabilities, Pyrogenic Chamber, Controller Module: WAVES (Sun), Heater: FTP (Fast Thermal Processor) | TEL | Alpha-8SE |
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| BIO/ANALYTICAL | ||
| SPECTROPHOTOMETER | BECKMAN | DU-62 |
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