INSPECTION/METROLOGY/MEASUREMENT
SEMICONDUCTOR FABRICATION & ASSEMBLY
BIO/ANALYTICAL

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DESCRIPTION
MAKE
MODEL
 
INSPECTION/METROLOGY/MEASUREMENT  

ANALYZER, WAFER /DISK, X-ray spectrometer, 200mm Wafer, Measures: Al (Thickness and Cu Wt%), 10K - PHA Films <3300A, 2030 LTS Ti Thickness, AMAT TiN Thickness, W CVD Thickness, W Nucleation, WSi Thickness, ULVAC TiN Thickness, BSG Boron wt%, BPSG Boron wt%

RIGAKU
WDA-3630
CRITICAL DIMENSION OVERLAY SYSTEM, 200mm Wafer, Unix Operating System, Objectives 4X,30X,70X, Xenon Lamp, SECS/GEM Interface, Ethernet Connection, Manf. 11/98
BIO-RAD
Q7/ Q8
DEFECT REVIEW SYSTEM Casette to Casette, 200mm, Color Camera and Monitor LEICA/VISTEC INS 2000
DIELECTRIC CHARACTERIZATION SYSTEM, Cocos, Silc, Epi-t, 200mm- 300mm, - Whole Wafer Mapping of Mobile Na Contamination in Oxide (~6000 Points in 12 Minutes), Tests Dielectric Capacitance / Electrical Thickness, Precise Determination of Flatband, Midgap and Oxide Voltages & Si Surface Barrier Height, Manf. 1999
SEMICONDUCTOR DIAGONISTICS INC.
FAaST 300
HEAVY METAL CONTAMINATION SYSTEM, SPV, 200mm-300mm, Non-Contact, Non-Destructive Measurements of Heavy Metal Contamination in Silicon, Whole Wafer Mapping in Minutes (>6000 Points in 9 Minutes), Whole Wafer Optical Fe Activation Station, Real-Time Identification of Iron & Copper, Sensitivity for FE: 1EB cm-2, Manf, 1997 SEMICONDUCTOR DIAGONISTICS INC.
FAaST 330
HEAVY METAL CONTAMINATION SYSTEM, SPV, Silc, Cocos, 100mm To 200mm Wafers, Fully Automated, Identifies Fe (Iron) AND Cu (Cooper) Contamination, Sensitivity Fe1E8 cm-2, Wafer Imaging >6000 Points in 9 Minutes, Auto Self Calibration; Manf. 10/02
SEMICONDUCTOR DIAGONISTICS INC.
FAaST 200
PROFILOMETER KLA TENCOR HRP 220
PROFILOMETER VEECO/SLOAN DEKTAK IIA
SPECTROPHOTOMETER, UV-VIS 200-900nm, Single Beam, Sipper Sampler, QUANT II, Protein Assay Module & Printer (1988)
BECKMAN
DU-62
TOTAL REFLECTION X-RAY FLOURESENCE, Surface Contamination Tool, 200mm Wafers
RIGAKU
3750
X-RAY SPECTROMETER, SINGLE CASSETTE, NESLAB COOLFLOW SYSTEM II CHILLER, EBARA 40 X 20 PUMP , MANF. 4/94
RIGAKU
3700H TXRF
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SEMICONDUCTOR FABRICATION 
THERMAL PROCESSING SYSTEM, DCS HTO, 200MM, N2 Load Lock Option, FTPS Option, WAVWES control, 21 cassette buffer, 2004 Vintage, DCS Hardware/software upgrade 9/2005 TEL Alpha-8SE
THERMAL PROCESSING SYSTEM , 200MM, 100 Wafer Batch Size, Process: FEOL Oxide/Anneal, Capable of Ultra Thin Oxides (12- 16 Angstrom), Nitrous & Nitric capabilities, Pyrogenic Chamber, Controller Module: WAVES (Sun), Heater: FTP (Fast Thermal Processor) TEL Alpha-8SE
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BIO/ANALYTICAL  
SPECTROPHOTOMETER BECKMAN DU-62
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CLICK HERE TO GET MORE INFORMATION
ABOUT ANY OF THE ITEMS ON THE LIST
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