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DESCRIPTION
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MAKE
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MODEL
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| OF SPECIAL INTEREST……. | ||
| PROFILOMETER, High Resolution, Cassette to Casette, 200mm-100mm, Verical resolution 0.1 Ǻ , Lateral Resolution 1nm | KLA TENCOR | HRP 220 |
| PROFILOMETER | KLA TENCOR | ALPHA STEP 300 |
| WAFER BOND UNIT | LOGITECH | IWB52 |
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| THIN FILM DEPOSITION/VACUUM | ||
| EVAPORATOR, 12" Jar, Manual | JEOL | JEE-4P |
| VACUUM
FURNACE, Approx 17" Diameter 26.5" Long, 600 C, Watlow 920 Programmer,
Honeywell Programer, Nitrogen Purge, w/ Stokes ES 013-2 Microvane 20 CFM
w/ Refrig. Cold Trap, Manuf. 1998 |
TM |
SS126D4121 |
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| INSPECTION/METROLOGY/MEASUREMENT | ||
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ANALYZER, WAFER /DISK, X-ray spectrometer, 200mm Wafer, Measures: Al (Thickness and Cu Wt%), 10K - PHA Films <3300A, 2030 LTS Ti Thickness, AMAT TiN Thickness, W CVD Thickness, W Nucleation, WSi Thickness, ULVAC TiN Thickness, BSG Boron wt%, BPSG Boron wt% |
RIGAKU |
3630 |
| CRITICAL DIMENSION
OVERLAY SYSTEM, 200mm Wafer, Unix Operating System, Objectives 4X,30X,70X,
Xenon Lamp, SECS/GEM Interface, Ethernet Connection, Manf. 11/98 |
BIO-RAD |
Q7/ Q8 |
| DIELECTRIC CHARACTERIZATION
SYSTEM, Cocos, Silc, Epi-t, 200mm- 300mm, · Whole Wafer Mapping of
Mobile Na Contamination in Oxide (~6000 Points in 12 Minutes), Tests Dielectric
Capacitance / Electrical Thickness, Precise Determination of Flatband, Midgap
and Oxide Voltages & Si Surface Barrier Height, Manf. 1999 |
SEMICONDUCTOR DIAGONISTICS
INC. |
FAaST 300 |
| FTIR SPECTROMETER,
Epi and Carbon Oxygen Content System, Gen Mark Robot, HP Vectra Computer,
Manf. 3/98 |
BIO-RAD |
QS-500 |
| HEAVY METAL CONTAMINATION SYSTEM, SPV, 200mm-300mm,· Non-Contact, Non-Destructive Measurements of Heavy Metal Contamination in Silicon, Whole Wafer Mapping in Minutes (>6000 Points in 9 Minutes), Whole Wafer Optical Fe Activation Station, Real-Time Identification of Iron & Copper, Sensitivity for FE: 1EB cm-2, Manf, 1997, | SEMICONDUCTOR DIAGONISTICS INC. |
FAaST 330 |
| HEAVY METAL CONTAMINATION
SYSTEM, SPV, Silc, Cocos, 100mm To 200mm Wafers, Fully Automated, Identifies
Fe (Iron) AND Cu (Cooper) Contamination, Sensitivity Fe1E8 cm-2, Wafer Imaging
>6000 Points in 9 Minutes, Auto Self Calibration; Manf. 10/02 |
SEMICONDUCTOR DIAGONISTICS
INC. |
FAaST 200 |
| PROFILE PROJECTOR,
20x Objective, 9" Dia. Rotating Projection Screen, Surface Reflection
Attachment, s/n 80136 |
MITUTOYO |
PJ-250H |
| PROFILOMETER, High Resolution, Cassette to Casette, 200mm-100mm, Verical resolution 0.1 Ǻ , Lateral Resolution 1nm | KLA TENCOR | HRP 220 |
| PROFILOMETER, LONG SCAN,
200mm Configuration, can be changed to 100-150mm (Not With System), Chuck
Compatable 100mm, 125mm, 150mm, 200mm Wafers, Manf. 5/92 |
KLA-TENCOR |
P2 |
| PROFILOMETER |
KLA-TENCOR |
ALPHA STEP 200 |
| PROFILOMETER |
KLA-TENCOR |
ALPHA STEP 300 |
| PROFILOMETER |
DEKTAK |
3030 |
| PROFILOMETER | VEECO | 8000 |
| PROFILOMETER |
SLOAN |
DEKTAK IIA |
| RESISTIVITY MAPPER,
50mm – 200mm Wafers, <5 mohm/sq to >5 Megohm/sq Measurement Range,
Typical Measurement Time: 3.5 – 4.5 Seconds per Test Site, <0.2%
(1 sigma) Measurement Repeatability, Thermal Chuck Temperature Measurement
Accuracy: ±0.5ºC, PC Based System Controller 25 MHz 486 Based
MPU, X-Y Map: Up to 1200 Sites Programmable, Probe Qualification: 20 sites,
1 - 30 Programmable Routine Test Sites (ASTM Standard Tests Included), Manf
1991 |
KLA-TENCOR |
RS55 |
| SPECTROPHOTOMETER,
UV-VIS 200-900nm, Single Beam, Sipper Sampler, QUANT II, Protein Assay Module
& Printer (1988) |
BECKMAN |
DU-62 |
| SURFACE ANALYSIS SYSTEM |
PMS |
3608 |
| TOTAL REFLECTION X-RAY
FLOURESENCE, Surface Contamination Tool, 200mm Wafers |
RIGAKU |
3750 |
| WAFER LOADER |
NIKON |
NWL-85 |
| X-RAY SPECTROMETER,
SINGLE CASSETTE, NESLAB COOLFLOW SYSTEM II CHILLER, EBARA 40 X 20 PUMP ,
MANF. 4/94 |
RIGAKU |
3700H TXRF |
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| SEMICONDUCTOR FABRICATION | ||
| LASER
MARKER |
WAFER
MARK |
WAFER
MARK II |
| OVEN, Isotemp, s/n 103 |
FISCHER SCIENTIFIC |
215G |
| THERMAL PROCESSING SYSTEM, DCS HTO, 200MM, N2 Load Lock Option, FTPS Option, WAVWES control, 21 cassette buffer, 2004 Vintage, DCS Hardware/software upgrade 9/2005 | TEL | 8SE |
| THERMAL PROCESSING SYSTEM , 200MM, 100 Wafer Batch Size, Process: FEOL Oxide/Anneal, Capable of Ultra Thin Oxides (12- 16 Angstrom), Nitrous & Nitric capabilities, Pyrogenic Chamber, Controller Module: WAVES (Sun), Heater: FTP (Fast Thermal Processor) | TEL | Alpha-8SE |
| THERMAL PROCESSING SYSTEM, 200MM, 138 Wafer Batch Size,FTP Fast Thermal Processing Option, Wafer on Fork Sensor Option, Process:Nitrous & Nitric Oxide,capabilities, | TEL | Alpha-8S |
| WAFER BOND UNIT,S/N 31-22-02 |
LOGITECH |
IWB52 |
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| RINSER/DRYER, ss CABINENT,
MANF. 12/93 |
VERTEQ |
SUPER CLEAN 1600 |
| US CLEANER, Batch 150mm
Wafers |
VERTEQ |
STOD-600-51L |
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| ETCHING | ||
| ASHER PLASMA , 10" (~25 cm) diameter approx. 16" (~40 cm) deep, Digital Pressure Display, Microprocessor Control, RF Power Indicator, Mass Flow Control and 500 Watt Continuous Variable RF Source. With Mechanical Pump | LFE PLASMA SYSTEMS | APE-110 |
| ETCHER, PLASMA, 18"x13" Chamber, s/n12769-1, w/ PM-108D RF Generator s/n 5095-2H | INTL PLASMA CORP | PM1813 |
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| ASSEMBLY | ||
| DISPENSER Automated Expoxy, Gantry w/ HS-Series RT Tactile Height Sensor, NS Series Needle Sensor, AV-700 Vision, DA-700, Sick 14 FGS Electronic Curtain, Pentium Computer Microsoft NT. Fluidmove for Windows FmNT v4.5, Monitor and Keyboard, 30” X 35” TMC Isolation Table | ASYMTEK | Century 702 |
| BONDER,Ball Multi purpose Gold Semi Auto & manual single point Tab,Ball bumping coining together w/standard ball bonding w/negative Electronic Flam Off. S/N 4102 3/96 | K&S | 4122 |
| REFLOW SOLDER s/n 423, w/ VTA-66 Head s/n 15923 w/ B&L Stereozoom Pod, w/ X-Travel Stage& Foot Pedal |
HUGHES |
HTT-650 |
| TAPE DE- LAMINATOR, 200mm, Programable | TAKATORI | ATRM-2100 |
| TAPE LAMINATOR, Programable
Fully Automated, 200mm |
TAKATORI |
ATM-1100C |
| WAFER BOND UNIT | LOGITECH | IWB52 |
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| DISK DRIVE TEST | ||
| READ/WRITE ANALYZER & SPIN STAND , S-1701 s/n 30643, RWA 1632 s/n 32327, ANA 961+ PRML options Clock Recover, ADC 2000, High Speed PG, Chip Adapter 320, ERA Interface, w/ computer keyboard and monitor | GUZIK | RWA-1632, S-1701MP Spin Stand, ANA 961+ PRML Analog Analyzer |
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| BIO/ANALYTICAL | ||
| BALANCE, Analytical, up to 159.9g, s/n 60445 | AINSWORTH | TYPE 24N |
| CHEMICAL HOOD AND TABLE, s/n 10892 (1989) | GELAIRE FLOW LABORATORIES | AIR, G |
| CONTACT ANGLE METER | TANTEC | AS |
| LASER | CONTINENTAL LASER CO. | 3000 SERIES |
| MOISTURE METER, s/n
1186-13-0 |
MEECO, INC. |
LBY |
| PARTICLE COUNTER, (8/30/93) | CLIMET | CI-4124-11 |
| REDUNDANT OUTPUT POWER SYSTEM, 24 Volt, NEW | ACOPIAN | R2H11AHS |
| REFRIGERATOR Class I, C, D, Explosion | LAB LINE | 3559 |
| SILVER RECOVERY UNIT, s/n 33KDO176 | DREW PRODUCTS | OMNIFIX15 |
| SEPARATION COLUMN | N/A | 12 LITER |
| SPECTROPHOTOMETER | BECKMAN | DU-62 |
| WATER BATH | NAPCO | 250 |
| WATER BATH, refrigerated, -12C to 100C, capacity 5 liters/1.3 gallons, pump capacity 13 liters/minute, cooling capacity 350 watts @ 20C | NESLAB | RTE-100 |
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